Adhesives that reduce CO2 emissions and Processes

Sustainable

No need of Heat-curing, enables both Energy saving and process reduction!

DIC Original

High bonding strength and good flexibility, with Hetero-adhesion features.

TYFORCE can remove the heat curing process! DIC can customize from raw material bases to meet your requirements and provide the best bonding solution.

3 reason that TYFORCE has been selected

1

【CO2 Reduction】 No heat curing⇒Achieve the process reduction!

Since it reacts with moisture after melt application and becomes self cross-linked, no need for a long curing process in thermosetting furnace.
Along with process shortening, CO2 emissions can be reduced in the thermosetting process.

【CO2 Reduction】 No heat curing⇒Achieve the process reduction!
2

Achieves both immediate bonding and high bonding strength, which was not possible with existing approaches!

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△Poor bonding strengths for Hot-melt adhesive
△It takes time to set for two-component adhesive
Don’t you have any of these issues?
TYFORCE can solve these issues!
By utilizing the benefits of both reactive and hotmelt adhesives, customers are able to extend the range of adhesive applications in addition to process savings.

3
Contributes to VOC reduction because of solvent-free type

TYFORCE is solvent free type, so it is eco-friendly adhesive which can reduce the VOC as well.
It does not contain organic solvents and eliminates the need for treatment of waste water and effluents.
It is also convenient in terms of storage and transport, as it is solid at room temperature.

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Click here for detailed data and a collection of case studies.
Why don’t you realize your company's SDGs actions
with our DIC’s TYFORCE?