Packaging & Graphic
Packaging materials that bring safety and peace of mind
This segment includes not only printing inks but also adhesives, materials and other products and solutions for packaging applications, the markets for which continue to see robust growth in emerging economies in Asia and elsewhere.
Printing Material
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Gravure Inks
DIC group provides a wide range of gravure printing inks for various applications from food package to industrial usage throughout the globe.
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Flexo Inks
DIC/Sun Chemical is a global leader in Flexographic inks and solutions.
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Metal Decorative Inks
Through historical business developments, DIC is now a leader in metal decorative inks and coatings in Japan, and metal decorative inks outside of Japan.
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Security Inks
The DIC Group is an active player in the brand protection and securities printing market.
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Jet Inks
DIC offers solutions to address customer needs by accumulated formulation capabilities and application expertise in the digital printing market which is increasingly evolving.
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Offset Inks
DIC offers news inks that meet customers' requirements around the globe.
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News Inks
DIC offers news inks that meet customers' requirements around the globe.
Packaging Material
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Packaging Adhesives
DIC has experienced many years of research, development and supply for adhesives and seal coatings.
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Coextruded Multilayer Films
"DIFAREN", DIC's coextruded multilayer film, is widely used for food and pharmaceutical packaging mainly. We offer the best solution to meet your needs.
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Polystyrene
Polystyrene comes in two types, GPPS with excellent transparency and HIPS with superior impact resistance, both of which are used in many fields.
News
- Nov. 22, 2024
- Exhibition & Event
- DIC to Unveil Omnidirectional Multicopter HAGAMOSphere™, Named as CES Innovation Awards® 2025 Honoree, at CES 2025
- Nov. 6, 2024
- Business & Product
- DIC and FPCO Achieve the Closed-Loop Recycling of Colored and Patterned Foamed Polystyrene Food Trays Using Material Recycling
- Oct. 10, 2024
- Business & Product
- DIC and Unitika Collaborate to Develop a Specialty PPS Film with Low Dielectric Properties Suitable for Use in a Key Material for Millimeter-Wave Printed Circuit Boards and Millimeter-Wave Radar
- Oct. 7, 2024
- Exhibition & Event
- DIC Announces Participation in TOKYO PACK 2024 with an On-Site Booth
and a Special Exhibition Page on Its Global Website
- Aug. 19, 2024
- Exhibition & Event
- Sun Chemical to Introduce Benda-Lutz COMPAL WS Preparations for Dipped Latex Applications at IRGCE 2024