Packaging & Graphic
Packaging materials that bring safety and peace of mind
This segment includes not only printing inks but also adhesives, materials and other products and solutions for packaging applications, the markets for which continue to see robust growth in emerging economies in Asia and elsewhere.
Printing Material
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Gravure Inks
DIC group provides a wide range of gravure printing inks for various applications from food package to industrial usage throughout the globe.
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Flexo Inks
DIC/Sun Chemical is a global leader in Flexographic inks and solutions.
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Metal Decoration Inks, Can Coatings
Through historical business developments, DIC is now a leader in metal decorative inks and coatings in Japan, and metal decorative inks outside of Japan.
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Security Inks
The DIC Group is an active player in the brand protection and securities printing market.
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Jet Inks
DIC offers solutions to address customer needs by accumulated formulation capabilities and application expertise in the digital printing market which is increasingly evolving.
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Offset Inks
DIC offers news inks that meet customers' requirements around the globe.
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News Inks
DIC offers news inks that meet customers' requirements around the globe.
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Packaging Material
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Packaging Adhesives
DIC has experienced many years of research, development and supply for adhesives and seal coating.
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Coextruded Multilayer Films
DIFAREN is a pioneer in coextruded multi-layer film and is used in many fields with a focus on food packaging.
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Polystyrene
Polystyrene comes in two types, GPPS with excellent transparency and HIPS with superior impact resistance, both of which are used in many fields.
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News
- Feb. 27, 2020
- Exhibition & Event
- 【Postponement】DIC to Exhibit Proprietary Polymers and Pigments at PAINT INDIA 2020—
India’s Premier Coatings Exhibition
- Jan. 17, 2020
- Business & Product
- DIC Develops Photomask that Prevents Electrostatic Discharge Damage
- Dec. 10, 2019
- Business & Product
- DIC Increases Production Capacity for Polystyrene
- Nov. 25, 2019
- Business & Product
- DIC Develops Versatile DUALAM™ Fast-Curing Solvent-Free Adhesive and Innovative Solvent-Free Lamination System
- Nov. 20, 2019
- Business & Product
- DIC Commences IoT Demonstration Experiment of Flexible Wireless Sensors at AEON Fujiidera Shopping Center
