Epoxy Resins

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Epoxy Resins Epoxy Resins

EPICLON epoxy resins are widely used in the fields of coatings, electrical/electronics, civil engineering, construction, and adhesives.

High-performance epoxy resin that achieves both heat resistance and flame retardancy, which are in a contradictory relationship to each other. The volume change against temperature is also small; therefore, it is the most appropriate epoxy resin to IC sealing material and package substrate which will be increasingly thinner and smaller in the future.

EPICLON HP-4710 is a new epoxy resin developed for cutting-edge electrical component materials that demand excellent heat resistance and low thermal expansion.

A liquid epoxy resin that achieves both flexible toughness and high reliability to resolve the problems of conventional products like high temperature exposure durability, PCT resistance, and acid/alkali resistance.

A new high performance liquid epoxy resin that fundamentally improves the hard, brittle properties that have been a quality problem of epoxy resins.

EPICLON HPC-8000-65T is a new epoxy curing agent developed for cutting-edge electrical component materials that demand excellent dielectric properties (low dielectric constant, low dissipation factor) and low hygroscopic properties.

What is Epoxy Resins?

Combined with curing agents, epoxy resins demonstrate superior bonding properties, corrosion resistance, and heat resistance, and they are widely used in the fields of coatings, electrical/electronics, civil engineering, construction, and adhesives. DIC stocks a number of products, from general purpose types to specialized types, for these wide-ranging applications.

DIC's Advantages

Major Applications

We introduce epoxy resins suitable for various applications such as FRP molding, floor coating, adhesives, coatings and encapsulants.

DIC's Epoxy Resins

  • Bisphenol A Liquid Epoxy Resins

    Bisphenol A Liquid Epoxy Resins

    Bisphenol A liquid epoxy resins are used in broad applications including coatings, civil engineering, adhesives, electrical insulating materials, and reactive intermediates.

  • Bisphenol A Solid Epoxy Resins

    Bisphenol A Solid Epoxy Resins

    Bisphenol A solid epoxy resins are used in broad applications including coatings, civil engineering, adhesives, electrical insulating materials, and reactive intermediates.

  • Bisphenol F Epoxy Resins

    Bisphenol F Epoxy Resins

    Bisphenol F epoxy resins are used in broad applications including coatings, civil engineering, adhesives, electrical insulating materials, and reactive intermediates.

  • Diluted Type Epoxy Resins

    Diluted Type Epoxy Resins

    Diluted epoxy resins are liquid epoxy resins that have been made low viscosity with a reactive diluent. These resins have been designed taking into consideration the balance between workability and cured material characteristics.

  • Bisphenol A Solvent-cut Epoxy Resins

    Bisphenol A Solvent-cut Epoxy Resins

    Bisphenol A solvent-cut products are bisphenol A solid epoxy resins mainly dissolved with various organic solvents. They are primarily used in coating applications.

  • Flame Retardant Epoxy Resins

    Flame Retardant Epoxy Resins

    Flame-retardant epoxy resins based on tetrabromobisphenol A. They possess a superb flame retardant effect and are used in semiconductor/electrical laminates in electric and electronic applications.

  • Cresol Novolac Epoxy Resins

    Cresol Novolac Epoxy Resins

    Cresol novolac high heat-resistance multifunctional epoxy resins. They are used for semiconductor encapsulants, electrical laminates, and solder resist.

  • Phenol/ Modified Novolac Epoxy Resins

    Phenol/ Modified Novolac Epoxy Resins

    Phenol novolac epoxy resins are multifunctional epoxy resins manufactured from phenol novolac resin and epichlorohydrin. When cured, they form cured materials that possess a mesh structure with a high cross-linking density.

  • Flexible Type Epoxy Resins

    Flexible Type Epoxy Resins

    Flexible type epoxy resins have improved impact resistance and flexibility by the introduction of plastic components. They are suited for applications that demand impact strength and adhesive applications.

  • Fast Curing Type Epoxy Resins

    Fast Curing Type Epoxy Resins

    Fast curing types are epoxy resins that have introduced multifunctional components. Since they excel in low-temperature fast curability, they are suited to room temperature curing coatings.

  • High Molecular Weight Type Epoxy Resins

    High Molecular Weight Type Epoxy Resins

    High molecular weight type epoxy resins are primarily used in baking finishes. Since they have a high molecular weight, they excel in coat forming ability in a single fluid.

  • High Performance Type Epoxy Resins

    High Performance Type Epoxy Resins

    High performance epoxy resins that excel in heat resistance, water resistance, ductility, and bonding properties. They are used in molding materials, semiconductor encapsulants, electrical laminates, and aerospace applications.

  • Polyamine, Polyamide for Curing Agents

    Polyamine, Polyamide for Curing Agents

    LUCKAMIDE Polyamine, Polyamide is an amine curing agent for room temperature epoxy resin curing. It is used as an impregnating agent for adhesives, coated floors, lining materials, and repairs.

  • Novolac Phenol Resin for Curing Agents

    Novolac Phenol Resin for Curing Agents

    PHENOLITE is a novolac phenol resin for epoxy resin curing agents. When a novolac phenol resin is used, the cross-linking density of the cured material is higher and heat resistance, moisture resistance, and chemical resistance are superior.

  • High Performance Specialized Epoxy Curing Agents

    High Performance Specialized Epoxy Curing Agents

    High performance epoxy curing agents that excel in heat resistance, water resistance, dielectric properties, and bonding properties. They are used in molding materials, semiconductor encapsulants, electrical laminates, and aerospace applications.

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