DIC to Exhibit at TOKYO PACK 2022 Via Virtual Platform and On-Site Booth —Together, we can realize a circular economy with “5R”—

  • Exhibition & Event
  • News Release
Oct. 5, 2022
#サーキュラーエコノミー #5R #3R #サステナブルパッケージ #リサイクル #廃プラスチック

Tokyo, Japan—DIC Corporation announced today that together with DIC Graphic Corporation it will participate in TOKYO PACK 2022—The Tokyo International Packaging Exhibition 2022, which will be held from October 12–14, 2022, at Tokyo International Exhibition Center (“Tokyo Big Sight”). The Company will also hold a simultaneous virtual trade show for those unable to attend in person.

DIC’s virtual trade show platform:https://www.dic-global.com/en/event/packaging/

In the area of packaging materials, the DIC Group is advancing the development of products and solutions in line with the “5Rs,” which combines the original 3Rs (“Reuse, Reduce and Recycle) with “Redesign” and “Reduce CO₂.”

Planned around the concept of “Together, we can realize a circular economy with “5R”” the DIC booth at TOKYO PACK 2022 will introduce state-of-the-art materials and technical information that will assist efforts to develop sustainable packaging. The booth will display an innovative laminating system employing DIC’s DUALAM™ solvent-free adhesives, conduct hands-on demonstrations of a waste plastics traceability system, and give a variety of presentations providing useful information.

Name: TOKYO PACK 2022—The Tokyo International Packaging Exhibition 2022
Date/time: October 12–14, 2022, 10:00 –17:00
Venue: Tokyo International Exhibition Center (Tokyo Big Sight) East Exhibition Halls (Halls 1–3, 6)
Organizer: Japan Packaging Institute
DIC booth: East Exhibition Hall 3-48

Printing inks and coatings
SunSpectro® Solvawash™ FL and SunSpectro® Solvawash™ GR (printing inks)
Polyvinylchloride (PVC)-free printing inks (under development)
SunPak® DIrectFood Plus (printing inks and aqueous overprint varnishes)
SunStar (direct food contact overprint varnishes and coatings)
OK compost-certified products
DIC biomass inks for offset printing
Biomass inks and adhesives (various series)
Marine Flex series (water-based flexo inks)
Functional coatings and heat-resistant sealants
Barrier coatings (various series)

Functional easy-peel films (DIFAREN® E3312T, DIFAREN® E7800TT and DIFAREN® E3601T)
Resealable films (under development)

Ultralow monomers (ULMs)
DUALAM™ (solvent-free adhesives)
PASLIM® and PASLIM® NS (adhesives with oxygen barrier properties)
PASLIM® MB-100A and PASLIM® MB-520B (under development)
DICDRY® 2K-SF series (biomass adhesives)
DICDRY® LX-RP (under development)

Polystyrene recycling
Closed-loop polystyrene recycling system

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