Application
Semiconductor Packaging / PWB / Electric Application
DIC's epoxy resins, when combined with curing agents, can help resolve issues such as solubility, moisture absorption and heat resistance, as well as support ultra-high speed communications.

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Liquid Type
■Bisphenol A Type
■Bisphenol F Type
■Naphthalene Type
■Flexible & Tough Type
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Solid Type
■Tri-Phenyl-Methane (TPM) Type
■Modified novolac Type
■Naphthalene Type
■Cresol Novolac Type
■Phenol Novolac Type
■Bisphenol A Novolac Type
■High-brominated Type
■Dicyclopentadiene(DCPD) Phenol Type
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Hardener
■Active Ester Type
■Phenol novolac Type
■Cresol novolac Type
■Bisphenol A novolac Type
■Amino triazine Phenol (/Cresol) novolac Type
Epoxy resin EPICRON
Epoxy resin EPICRON
Contact Us
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Contact us via website
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