DIC to Exhibit at the AUTOMOTIVE ENGINEERING EXPOSITION 2021 ONLINE —Exhibit will showcase cutting-edge materials that help reduce vehicle weight and enhance performance—

  • Exhibition & Event
  • News Release
May 19, 2021
#automotive #showcase #EV #CASE #mobility #automobiles

Tokyo, Japan—DIC today announced that it will exhibit cutting-edge materials for automotive applications at the AUTOMOTIVE ENGINEERING EXPOSITION 2021 ONLINE, which will be held May 26–July 30, 2021.

Dates: May 26–July 30, 2021
Venue: Online
Official website: https://aee.expo-info.jsae.or.jp/en/online/
(Currently accepting registrations)

DIC's Webpage:https://aee.online.jsae.or.jp/ja/exhibition/detail.html?id=200
(Accessible for the duration of the exhibition, beginning from 10:00 am on May 26, 2021)

DIC’s online exhibit will showcase a variety of materials for that will help increase the energy efficiency and performance of automobiles today and in the future. These products can be viewed by registered attendees accessing the following URL during the period of the exhibition.
(Accessible for the duration of the exhibition, beginning from 10:00 am on May 26, 2021)

Product name

Description

Key performance features

『DICARBO®LF』

Fast-curable carbon fiber prepreg

Helps reduce weight and lower process costs

CeramNexTM

Special Shape alumina filler

Imparts heat-dissipating and insulating properties, strength and designability

TrinDy®』and others

Additive Manufacturing Materials

(Functional filaments, stereolithography materials)

Facilitate mold-free modelling; customizable,

antiviral, thermoplastic, easily processed

DIC.PPS

PPS compounds

Help reduce weight and adds heat and chemical resistance

PEONY®』『FUNECON®

Functional compounds/masterbatches for various thermoplastics

Antiviral; deliver high level of jetness; boast flame-resistance, and insulating and heat dissipating properties

DAITAC®

Double-sided industrial-use tapes, adhesive tapes

Excellent outgassing resistance, transparency and durability

TYFORCE®

Environment-friendly reactive hot melt adhesives

Boast superb adhesion to different types of materials; solventless; shorten processing time

-Ends-

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