DIC Announces Participation in TOKYO PACK 2026 —Proposing new value through co-creation with partners in line with the theme
“Enveloping Value. Create Colorful Connections.”—

Tokyo, Japan—DIC Corporation announced today that it will participate, together with subsidiary DIC Graphics Corporation, in the Tokyo International Packaging Exhibition 2026 “TOKYO PACK 2026”, which will be held from October 14 to 16, 2026, at TOKYO BIG SIGHT (the Tokyo International Exhibition Center). The Company has also created a dedicated TOKYO PACK 2026 page on its global website to introduce the products, technologies and solutions featured at its on-site booth.

The DIC Group deploys a variety of initiatives in the area of packaging solutions aimed at contributing to a sustainable society. With the goal of advancing the realization of a circular economy, the Group emphasizes collaboration across the entire value chain, from raw materials procurement through to production, collection and recycling, and is working to create new value through co-creation with customers and partner companies.

At its TOKYO PACK 2026 booth, DIC will showcase a wide range of DIC Group products and technologies, as well as solutions developed together with partner companies in Japan and overseas, in line with the theme “Enveloping Value. Create Colorful Connections.” Through such offerings, the Group seeks to help address diverse challenges around packaging — including improving recyclability, conserving resources, ensuring quality, bolstering brand value and increasing frontline production efficiency—and to foster new business opportunities.

DIC’s booth will also offer visitors the opportunity to take part in a number of activities enabling them to directly experience DIC Group products, technologies and sustainability initiatives, including through interactive content utilizing augmented reality (AR).

• The DIC Sustainable Packaging Site
　Provides the latest information on packaging products and technologies, as well as on market trends.
　https://www.dic-global.com/en/solution/packaging_graphics/packaging/

Name: TOKYO PACK 2026 (Tokyo International Packaging Exhibition 2026)
Date and time: October 14–October 16, 2026, 10:00–17:00
Venue: TOKYO BIG SIGHT (Tokyo International Exhibition Center), East Halls 1–3, 7 and 8
Organizer: Japan Packaging Institute
DIC’s booth: East Hall 2, Booth 2R04
Official website:https://www.tokyo-pack.jp/

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