DIC Announces Participation in TOKYO PACK 2024 with an On-Site Booth
and a Special Exhibition Page on Its Global Website — A total of 27 products and solutions will be featured, including through a collaborative exhibit,
in line with the theme “A new step toward sustainable packaging for the future” —

Exhibition & Event
News Release

Oct. 7, 2024

#Sustainability #Sustainable #Packaging #5R

Tokyo, Japan—DIC Corporation announced today that it will participate, together with subsidiary DIC Graphics Corporation, in the Tokyo International Packaging Exhibition 2024 (TOKYO PACK 2024), which will be held from October 23 to 25, 2024, at the Tokyo International Exhibition Center (“Tokyo Big Sight”). The Company has also created a dedicated TOKYO PACK 2024 page on its global website that introduces the products and solutions displayed at its on-site booth.

The DIC Group’s TOKYO PACK 2024 dedicated website page

The DIC Group deploys a variety of initiatives in the packaging field aimed at contributing to the achievement of sustainability for the earth and society in line with its proprietary 5Rs framework, which adds “renew” and “redesign” to the original 3Rs (“reuse, reduce, recycle”). Guided by this approach, the Group promotes the development of products and solutions, as well as working with its many stakeholders, with the goal of advancing the realization of a circular economy. The DIC Group’s TOKYO PACK 2024 on-site booth and dedicated website page will feature a total of 27 products and solutions, including through a collaborative exhibit with partner companies, in line with the theme “A new step toward sustainable packaging for the future.”

Examples of collaborative exhibit products and solutions
■ A solution that encourages recycling by combining DIC’s top-seal technologies (including those for easy-peel sealant film) with state-of-the-art printing technologies from a partner company
■ An innovative lamination system employing DIC’s DUALAM™ solvent-fee adhesive that helps reduce CO2 emissions developed jointly with a partner company

A variety of mini-presentations providing useful information for visitors are also scheduled to be held at the DIC Group’s on-site booth.

Exhibition details
Name: TOKYO PACK 2024 (Tokyo International Packaging Exhibition 2024)
Date and time: October 23–October 25, 2024, 10:00–17:00
Venue: Tokyo International Exhibition Center (“Tokyo Big Sight”), East Exhibition Halls 1–6
Organizer: Japan Packaging Institute
DIC’s booth: East Exhibition Hall 2U01
Official website: https://www.tokyo-pack.jp/en/

– Ends –