Key Points of the Exhibition
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POINT 1
- We will exhibit a collaborative project for next-generation packaging
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POINT 2
- You can collect the latest information on many sustainable packaging
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POINT 3
- Our expert staff will be on-site to provide solutions to your issues
Collaborative exhibits with partner companies at the DIC booth
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To advance the Circular Economy, DIC will showcase several innovative proposals in collaboration with our partner companies at the DIC booth.
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We are planning several collaborative exhibits
■Examples of collaborative exhibits■
[A revolution in solvent-free lamination!]
A proposal for sustainable packaging made possible by a machine manufacturer's dual lamination system and DIC's solvent-free adhesive (DUALAM™)
[Mono-material packaging without paper labels]
Collaboration of our partners' printing technology and DIC's material technology
Demonstration of mono-material easy peel film will be held at the venue
[Working with Yokkaichi City to Realize a Carbon-Free Society]
To implement DIC’s polystyrene recycling system, RePOS®, in society, we are conducting experiments with Yokkaichi City on a resource circulation model for recovered polystyrene
We will present the RePOS® system and our collaboration with Yokkaichi City at the venue
At the DIC booth,
We will host ‘Petit Seminars’ led by our expert staff
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The ”Petit Seminars" will cover various themes related to sustainable responses, and are casual seminars that allow you to gather the latest information in 15 minutes or less. The schedule for the day will be posted on this special page shortly.
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[Theme of the ”Petit Seminars"]
- The Challenge of Mono-material Packaging Created in Partnership
- “DUALAM™”, a solvent-free adhesive with a new concept of separate coating type adhesive
- Realization of advanced recycling of waste film by deinking and de-coating
- DIC COLORCLOUD® S, a Digital Service for Efficient Color Reproduction in Package Printing
- Introduction of overseas results of EB printing in flexible packaging
- Co-extruded multilayer film “DIFAREN®” environmentally friendly packaging proposal
- Proposal for a New Solvent-Free Adhesive Solution
- DIC's Idea of Complete Recycling of Polystyrene
- Color Universal Design for Packaging
We have prepared a 5-minute video that explains the key points of the exhibition.
Please take a look!
(5min. 34sec.)
INFORMATION
Exhibit Information
| Event period | From October 23 to 25, 2024 |
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| Venue | Tokyo Big Sight (Tokyo International Exhibition Center) East Building 2U01  |
Visit the DIC booth to explore the latest trends in mono-material packaging and recycling solutions.
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- Date and time
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Thursday, October 24th 10:30~11:00
- Theme
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Introducing functional materials and solutions that enable sustainable packaging design
- Lecturer
- Syouhei Koba
Packaging Technology Division, Sustainability Solutions Technology Group
Group Manager - Seminar Venue
- East Hall 6 Room F
- How to participate
- Same-day registration, first come first served
TOKYO PACK 2024 Site Seminar Information
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EVENT
DIC to take the stage at exhibitors' seminar on the latest packaging technology
LINK
You can find the latest information on sustainable packaging here.
EXHIBITION OUTLINE
TOKYO PACK 2024 Event Overview
| TOKYO PACK 2024 | |
| Organizer | Japan Packaging Institute |
| Event period | From October 23 to 25, 2024 10:00-17:00 |
| Venue | Tokyo Big Sight (Tokyo International Exhibition Center) A free invitation ticket is required to enter the exhibition. If you do not have an invitation ticket, please apply for one via the official website below. TOKYO PACK 2024 Official Website  You will be redirected to an external site. |
