Epoxy Resins

Bisphenol A liquid epoxy resins are used in broad applications including coatings, civil engineering, adhesives, electrical insulating materials, and reactive intermediates.

Bisphenol A solid epoxy resins are used in broad applications including coatings, civil engineering, adhesives, electrical insulating materials, and reactive intermediates.

Bisphenol F epoxy resins are used in broad applications including coatings, civil engineering, adhesives, electrical insulating materials, and reactive intermediates.

Diluted epoxy resins are liquid epoxy resins that have been made low viscosity with a reactive diluent. These resins have been designed taking into consideration the balance between workability and cured material characteristics.

Bisphenol A solvent-cut products are bisphenol A solid epoxy resins mainly dissolved with various organic solvents. They are primarily used in coating applications.

Flame-retardant epoxy resins based on tetrabromobisphenol A. They possess a superb flame retardant effect and are used in semiconductor/electrical laminates in electric and electronic applications.

Cresol novolac high heat-resistance multifunctional epoxy resins. They are used for semiconductor encapsulants, electrical laminates, and solder resist.

Phenol novolac epoxy resins are multifunctional epoxy resins manufactured from phenol novolac resin and epichlorohydrin. When cured, they form cured materials that possess a mesh structure with a high cross-linking density.

Flexible type epoxy resins have improved impact resistance and flexibility by the introduction of plastic components. They are suited for applications that demand impact strength and adhesive applications.

Fast curing types are epoxy resins that have introduced multifunctional components. Since they excel in low-temperature fast curability, they are suited to room temperature curing coatings.

High molecular weight type epoxy resins are primarily used in baking finishes. Since they have a high molecular weight, they excel in coat forming ability in a single fluid.

High performance epoxy resins that excel in heat resistance, water resistance, ductility, and bonding properties. They are used in molding materials, semiconductor encapsulants, electrical laminates, and aerospace applications.

LUCKAMIDE Polyamine, Polyamide is an amine curing agent for room temperature epoxy resin curing. It is used as an impregnating agent for adhesives, coated floors, lining materials, and repairs.

PHENOLITE is a novolac phenol resin for epoxy resin curing agents. When a novolac phenol resin is used, the cross-linking density of the cured material is higher and heat resistance, moisture resistance, and chemical resistance are superior.

High performance epoxy curing agents that excel in heat resistance, water resistance, dielectric properties, and bonding properties. They are used in molding materials, semiconductor encapsulants, electrical laminates, and aerospace applications.