Enveloping Value.
Create Colorful Connections.
DIC to Exhibit at TOKYO PACK 2026
CONCEPT
DIC Packaging Solutions
Supporting a Sustainable Future
As interest in environmental sustainability continues to grow,
collaboration is essential to realizing a circular economy.
Guided by our 5R principles,
we create new value through environmentally conscious initiatives and
provide packaging solutions that contribute to a sustainable society.
At TOKYO PACK 2026,
we will introduce these initiatives under the theme of Partnership.
Six Exhibition Themes: Enveloping Value, Creating the Future
At the DIC booth, we will showcase a wide range of solutions across six exhibition themes aimed at advancing the circular economy.
Come experience new possibilities created through materials, technology, and co-creation.
- RePOS®: a fully circular recycling model for used polystyrene
- DeReSus®: de-inking and de-coating technology to accelerate film recycling
- SHIOLESS™: PVC-free gravure laminating inks
for better package recyclability - A wide range of flexo inks from a global leader in flexographic printing inks
- oneBARRIER: PE mono-material solutions with ultra-high barrier properties, contributing to the recycling of plastic packaging
- Stand-alone films that combine environmental consideration with productivity
- De-inking and delamination technology promoting material recycling of flexible packaging
- Flexo Trolley: a lower-VOC, more efficient laminating process
- DUALAM™ solvent-free adhesive: a fast-curing solution
that cuts production time and losses to maximize efficiency - Volume reduction × mono-materialization
Deep-draw mono-material film without a tray - Paper cans for offset inks that reduce environmental impact
and combine barrier performance with recyclability - ECOVART gravure inks: resolving issues during naphtha shortages
and delivering diverse value such as VOC and inventory reduction - Mono-web solution that simplifies recycling
- E7101T easy-peel film: enabling top-sealing
of next-generation C-PET containers - DIFAREN® L3300T and L3301T LLDPE sealant films:
enabling high-speed filling of retort packaging - Inkjet ink solutions opening the way to next-generation digital packaging printing
- DIC COLORCLOUD® color solution: eliminates wasteful color matching
to cut costs and conserve resources - Next-generation solvent-free adhesives that broaden areas of application
- Textured matte films: creating a premium look, environmental consideration × design
- Next-generation matte coating agents delivering environmental compatibility and high-end design
- DIFAREN® film series: helping maintain product quality
by preventing active ingredients from escaping or being absorbed - Anti-fog film series: showcasing the food's appeal,
helping extend shelf life and reduce food loss - CPP sealant film for ultrasonic sealing: supporting the future of packaging
with both environmental compatibility and production efficiency
- Coating solutions that create the "safety and security" of the future
- Development of a framework for reporting CO2 removal through biochar ink using startup technology
- DIC's packaging material technology solutions
that respond to future packaging trends
BOOTH
What You Can Experience at the Booth
Creating New Value Through Co-Creation with Partners
Discover a range of solutions developed through co-creation with our partners. By collaborating with companies across the value chain and working toward a more sustainable society, we are creating new value and exploring the future possibilities of packaging.
Co-Creation Initiatives Shaping the Future of Packaging
Selected initiatives
[From Waste to Resource: Initiatives Toward a Decarbonized Society]
Together with partner companies, we aim to establish RePOS®, a fully circular recycling model for polystyrene.At the venue, we will introduce our initiatives with Yokkaichi City, Mie Prefecture, including environmental education and other activities aimed at raising environmental awareness in the local community.
[De-inking and Delamination Technology for Flexible Packaging Recycling]
As part of a joint initiative with partner companies to promote the material recycling of flexible packaging through de-inking and delamination technologies, we will introduce our efforts to standardize evaluation and testing conditions through the development and publication of a unified protocol.[PFAS- and Plastic-Free Packaging Technology: "Morro Coating"]
Morro Coating is a plant-based barrier coating developed by a start-up spun out of the University of Cambridge.We will introduce a collaborative initiative between DIC and its partner company.
Go Beyond Seeing—Experience DIC's Solutions Through Augmented Reality (AR)
Through exclusive AR content available only at the venue, experience DIC's technologies and get a closer look at manufacturing sites that are normally out of view.
RePOS®
See through AR how polystyrene food trays are given new life as valuable resources in a circular economy. This is where the cycle begins.
DeReSus®
Explore the ink layers of packaging films and experience through AR how de-inking and de-coating enable the films to be recycled into new pellets.
One-on-One Consultations with Our Experts
Our specialists, who are well versed in the packaging field, will carefully listen to your challenges and needs and recommend the most suitable solutions. Please feel free to consult us on a wide range of topics, including product development and environmental initiatives, as well as any questions about the exhibits.
SEMINAR
1
Mini Seminar: Key Takeaways in Minutes
Mini seminars will be held at the front of the DIC booth throughout the three-day event. Learn about the latest trends in sustainable packaging and DIC's initiatives through clear, concise presentations. Combine the seminars with a visit to our exhibits for a deeper understanding of the features and value of each solution.
Mini Seminar ScheduleEach session runs for 15 minutes and will be held in front of the DIC booth.
- 11:30-11:45DeReSus® A De-inking Solution Enabling Advanced Film Recycling
- 13:00-13:15Mono-web solution that simplifies packaging by rethinking conventional multilayer structures
- 13:30-13:45Solutions to Societal Challenges in Collaboration with BOBST and ALTEC – oneBARRIER & Flexo Trolley
- 14:00-14:15Inkjet Ink Solutions for Digital Packaging Optimization
- 14:30-14:45CPP sealant film for ultrasonic sealing
- 15:00-15:15CIRCULAR LEARNING JOURNEY manaboni: From "Knowing" to "Taking Action" on Resource Circulation
- 15:30-15:45Conserving resources with DUALAM™ solvent-free adhesive
- 11:30-11:45Solutions to Societal Challenges in Collaboration with BOBST and ALTEC – oneBARRIER & Flexo Trolley
- 13:00-13:15Inkjet Ink Solutions for Digital Packaging Optimization
- 13:30-13:45CPP sealant film for ultrasonic sealing
- 14:00-14:15CIRCULAR LEARNING JOURNEY manaboni: From "Knowing" to "Taking Action" on Resource Circulation
- 14:30-14:45Conserving resources with DUALAM™ solvent-free adhesive
- 15:00-15:15DeReSus® A De-inking Solution Enabling Advanced Film Recycling
- 15:30-15:45Mono-web solution that simplifies packaging by rethinking conventional multilayer structures
- 11:30-11:45CPP sealant film for ultrasonic sealing
- 13:00-13:15CIRCULAR LEARNING JOURNEY manaboni: From "Knowing" to "Taking Action" on Resource Circulation
- 13:30-13:45Conserving resources with DUALAM™ solvent-free adhesive
- 14:00-14:15DeReSus® A De-inking Solution Enabling Advanced Film Recycling
- 14:30-14:45Mono-web solution that simplifies packaging by rethinking conventional multilayer structures
- 15:00-15:15Solutions to Societal Challenges in Collaboration with BOBST and ALTEC – oneBARRIER & Flexo Trolley
- 15:30-15:45Inkjet Ink Solutions for Digital Packaging Optimization
SEMINAR
2
DIC to Present at a TOKYO PACK 2026 Exhibitor Seminar
- Theme
- Realizing a Circular Economy
and Creating Sustainable Value Through Partnerships - Date & Time
- October 14, 2026 (Wed) 14:20 - 14:50
- Speaker
-
Shigekazu Takahashi
Packaging & Graphic Business Development Group
At the beginning of the seminar, a Global Director from Sun Chemical, a DIC Group company, will also give a presentation. (Simultaneous interpretation available) - Venue
- Venue C (Seminar Room, East Hall 2)
- Registration
- On-site registration, first-come, first-served TOKYO PACK 2026 Seminar Information
INFORMATION
- Exhibition
- TOKYO PACK 2026
Tokyo International Packaging Exhibition 2026 - Organizer
- Japan Packaging Institute
- Dates
- October 14-16, 2026
- Venue
- TOKYO BIG SIGHT, East Halls 1–3, 7 & 8
- Opening Hours
- 10:00-17:00
- DIC Booth
- East Hall 2, Booth 2R04
Exhibition Information
Technology
~The link between
our future planet
and generations~ Register to Visit *You will be redirected
to the official
TOKYO PACK website.
Visit the DIC Booth
RePOS® Character: Ripo-chan
Ripo-chan is the RePOS® character who loves giving used plastics a new life through recycling.
Come meet Ripo-chan at the DIC booth!
LINK
Explore the Latest in Sustainable Packaging
The DIC Sustainable Packaging website provides the latest content on packaging, including product information, technical insights, market trends, and webinar updates. We invite you to explore the site.
DIC Sustainable Packaging Site
