DUALAM™
New solvent-free adhesive that increases
production efficiency by 50%
Solvent-free lamination reduces environmental impact—but performance has long been the challenge. Discover how DIC redefines solvent-free lamination with its next-generation system, DUALAM.
What is DUALAM
DUALAM is a revolutionary, fast-curing, solvent-free lamination adhesive syste m co-developed by DIC and a leading machinery manufacturer. Compared with conventional solvent-free lamination, DUALAM delivers:
Ultra-Fast curing with 50% shorter Ageing Time
Minimize Adhesive Waste by 40%
Up to 3× more packaging applications with improved appearance
How DUALAM works
DUALAM consists of two distinct coating groups where the two components of adhesive are applied individually and merge only in the nipping station enabling faster, more stable application and a streamlined lamination workflow.
Packaging Application of DUALAM
DUALAM makes it possible to create multi-layer laminated packaging with a clean, solvent-free adhesive solution.
Snack packaging
Standing pouch
Boil, retort pouch
Why Choose DUALAM
A Total of 21 Patents Registered
Top‑Level Support System in 62 Countries
Assured After‑Sales Services
Visit Us
Want to see the machines in action?
DIC offers opportunities to watch the equipment running live and speak directly with our experts. You can also request testing for your desired packaging structure.