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High Performance Specialized Epoxy Curing Agents

High performance epoxy curing agents that excel in heat resistance, water resistance, dielectric properties, and bonding properties. They are used in molding materials, semiconductor encapsulants, electrical laminates, and aerospace applications.

Major Product Specifications & Features

EPICLON Active Equivalent Weight Viscosity Features Applications
HPC-8000-65T 222 - 224 3000 – 4000 mPa·s 25°C Low dielectric constant, low dissipation factor Laminate materials, interlayer insulating materials

DIC can also customize these products in various ways. Contact us for details.

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