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High Performance Types

High performance epoxy resins that excel in heat resistance, water resistance, ductility, and bonding properties. They are used in molding materials, semiconductor encapsulants, electrical laminates, and aerospace applications.

Major Product Specifications & Features

EPICLON Epoxy Equivalent Weight
(g/eq)
Softening Point
(°C)
Melt Viscosity
(dPa.s, 150°C)
Features Applications
HP-4032 145 - 157 Semi-solid 900 - 1400(*1) Naphthalene Composite materials, adhesives
HP-4032D 136 - 148 Liquid or crystal 500 - 600(*2) Naphthalene, distilled product Liquid encapsulant
HP-7200L 242 - 252 50 - 60 0.1 - 1.0 Dicyclopentadiene IC encapsulant
HP-7200 254 - 264 56 - 66 0.1 - 2.0 Dicyclopentadiene IC encapsulant
HP-7200H 272 - 284 78 - 88 2.0 - 6.0 Dicyclopentadiene IC encapsulant
HP-7200HH 274 - 286 88 - 98 4.0 - 12.0 Dicyclopentadiene IC encapsulant, adhesives
HP-7200HHH 280 - 292 100 - 110 28.0 - 38.0 Dicyclopentadiene IC encapsulant, adhesives, electrical laminates
HP-4700 160 - 170 85 - 95 3.0 - 6.0 Naphthalene IC encapsulant
HP-4770 200 - 210 67 - 77 0.1 - 2.0 Naphthalene IC encapsulant
HP-5000 245 - 260 56 - 64 0.3 - 1.5 Naphthalene backbone modified polyfunctional type IC encapsulant, electrical laminates
HP-6000 235 - 255 65 - 85 1.5 - 3.0 Naphthalene
Heat resistance/flame retardancy/low thermal expansion
IC encapsulant
Package substrate
HP-4710 160 - 180 85 - 105 4.0 - 14.0 Naphthalene Electrical laminates
EXA-4850-150 410 - 470 Liquid 13000 - 19000(*3) Flexible toughness Liquid encapsulants, adhesives
EXA-4850-1000 310 - 370 Liquid 60000 - 120000(*3) Flexible toughness Liquid encapsulants, adhesives
EXA-4816 390 - 410 Liquid 1,300,000 - 1,500,000 High-durability flexible toughness Liquid encapsulants, adhesives
HP-820 200 - 250 Liquid 1000 - 3000(*3) Alkylphenol Coatings, adhesives, diluents
  • *1 52°C, mPa.s
  • *2 50°C, mPa.s
  • *3 25°C, mPa.s

DIC can also customize these products in various ways. Contact us for details.

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