• Global Site
  • About DIC
  • Business
  • IR
  • Sustainability
  • R&D

WORLDWIDE

Encapsulants

Encapsulants

When using epoxy resins as semiconductor encapsulants, high purity, low moisture absorption, superb curability, high heat resistance, and environmental friendliness (lead-free solder support, non-halogen flame resistance) are primarily required as the desired performance. DIC's epoxy resins feature a lineup of products with characteristics that can meet these requirements.

Performance Requirements & Major Corresponding Products

  • Lead-free Solder Support

    To achieve this ability, low viscosity, a low moisture absorption rate, low elastic modulus when heated, and high bonding properties are effective. DIC recommends products that combine these abilities at a high level.

  • Non-halogen Flame Resistance

    Advanced functions such as flame resistance, heat resistance, moisture resistance, and dielectric characteristics must be combined in cutting-edge electronics fields. DIC recommends products that have combined these characteristics at a high level.

  • High Heat Resistance

    High heat resistance is required in BGA and automotive applications. DIC recommends products with low melt viscosity and excellent curability.

For inquires related to these products
For inquires via the web Contact Form

Europe | HOME > DIC Products > EPICLON Epoxy Resins > Encapsulants