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Cresol Novolac

Cresol novolac high heat-resistance multifunctional epoxy resins. They are used for semiconductor encapsulants, electrical laminates, and solder resist.

Major Product Specifications & Features

EPICLON Epoxy Equivalent Weight
(g/eq)
Softening Point
(°C)
Melt Viscosity
(dPa.s, 150°C)
Features Applications
N-660 202 - 212 62 - 70 1.0 - 3.0 Standard product IC encapsulant
N-665 202 - 212 65 - 74 2.0 - 4.0 Standard product IC encapsulant
N-670 205 - 215 69 - 77 3.5 - 5.5 Standard product IC encapsulant
N-673 205 - 215 73 - 82 5.0 - 7.5 Standard product IC encapsulant
N-680 206 - 216 82 - 92 10.0 - 16.0 Standard product Resist
N-690 209 - 219 88 - 98 17.0 - 27.0 Standard product Resist
N-695 209 - 219 90 - 100 24.0 - 34.0 Standard product Resist
N-665-EXP 198 - 208 65 - 73 2.5 - 4.0 High purity IC encapsulant
N-672-EXP 199 - 209 71 - 79 4.5 - 6.0 High purity IC encapsulant
N-655-EXP-S 196 - 206 54 - 62 0.5 - 2.0 High purity, high moldability IC encapsulant
N-662-EXP-S 197 - 207 64 - 72 2.0 - 3.5 High purity, high moldability IC encapsulant
N-665-EXP-S 197 - 207 68 - 76 3.5 - 5.0 High purity, high moldability IC encapsulant
N-670-EXP-S 198 - 208 70 - 80 4.5 - 6.0 High purity, high moldability IC encapsulant
N-685-EXP-S 198 - 208 80 - 90 9.0 - 15.0 High purity, high moldability IC encapsulant
N-673-80M 200 - 230(※1) - 2500 - 7000(※2) Solid content 80% MEK solution Laminates
N-680-75M 200 - 230(※1) - 500 - 2500(※2) Solid content 75% MEK solution Laminates
N-690-75M 210 - 240(※1) - 1000 - 3200(※2) Solid content 75% MEK solution Laminates
  • *1: Solid content
  • *2 25°C, mPa.s

DIC can also customize these products in various ways. Contact us for details.

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