Solvent Soluble Amide-imide Resins

Features

Amide-imide resins have rigid imide backbone and terminal carboxyl groups which is useful for application as hardener for epoxy resins. They demonstrate excellent compatibility with general-purpose solvents and various epoxy resins, and provide super heat resistance when cured with epoxy resins.

Applications

Inter-layer insulators, such as for semiconductors and printed circuit boards, build-up materials, solder resist materials, coverlay materials, encapsulant materials, buffer coating agents, insulation inks for ink-jet, heat-resistant refractory coatings, heat-resistant adhesives, wear materials, carbon fiber reinforced materials and flame retardants.

Lineup

V-8000BM EMG-1015 EQG-1170(R&D)
V-8000BM >EMG-1015 EQG-1170(R&D)
Aromatic amide or imide framework Aliphatic amide or Imide framework Carboxyl group Acryloyl group
Branched aromatic amide-imide resin Branched aliphatic amide-imide resin UV curable aliphatic amide-imide resin
(Features)
Excellent heat resistance
Compatibility
Compliance with CSCL
(Features)
Pale yellow
Excellent heat resistance
Compliance with CSCL
(Features)
UV curable
Pale yellow
Excellent heat resistance
Low volume new substances under CSCL
Product name Appearance Internal solvent Non-volatile content (%) Viscosity(Pa•s)/25℃ Solution acid value(mg KOH/g)
V-8000BM Yellow~Green liquid BuAc/MEK 34~39 0.5~4 35~50
EMG-1015 Pale yellow liquid PGMAc 41.5~44.5 1~10 55~85
EQG-1170 Pale yellow liquid PGMAc 43~45 0.5~1.5 55~65
  • BuAc:Butyl acetate (b.p.=126℃)
  • MEK:Methyl ethyl ketone (b.p.=80℃)
  • PGMAc:Propylene glycol methyl-ether acetate (b.p.=146℃)
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