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EPICLON HP-4710 Ultra-high Heat-resistant Epoxy Resin

EPICLON HP-4710 is a new epoxy resin developed for cutting-edge electrical component materials that demand excellent heat resistance and low thermal expansion.

Features

  • Ultra-high heat resistance (world's highest level)
  • General-purpose solvent solubility
  • Low thermal expansion

Applications

  • Printed circuit board materials (semiconductor package substrates)
  • Core materials for build-up, insulated films
  • Automotive components

Resin Physical Properties

  • High density functional groups
  • High solubility for general-purpose solvents

Resin physical properties (compared to representative resin)

Product Number HP-4710 N-770 Phenolic Novolac
External Appearance Brown solid Light yellow solid
Epoxy Equivalent Weight (g/eq.) 170 188
Softening Point (°C) 95 70
Melt Viscosity (ICI) (150°C, dPa·s) 9.0 5.5
Solvent Solubility (MEK) Dissolves Dissolves

Cured Material Physical Properties (Tg) [Resin Independent Evaluation]

Imidazole Curing

  • Achieves an ultra-high glass transition temperature that reaches 350°C

Phenolic Novolac Curing

  • Achieves the world's highest level of heat resistance in epoxy resins
  • Approximately 50°C increase in heat resistance compared to the phenolic novolac type

Imidazole Curing

[Evaluation Conditions]
Curing agent: Imidazole (2E4MZ) 2 phr
Curing conditions: 200°C/5 hr

Phenolic Novolac Curing

[Evaluation Conditions]
Curing agent: Phenolic Novolac (TD-2131: softening point 80°C)
Accelerator: TPP (1 phr), Curing conditions: 175°C/5 hr

Cured Material Physical Properties (CTE) [Resin Independent Evaluation/Phenolic Novolac Curing]

  • Demonstrates a low coefficient of linear expansion
  • The coefficient of linear expansion (25 to 280°C) decreases about 20% compared to phenolic novolac

Cured material physical properties (Tg/solder-resistant) compared to representative resin

Product Number HP-4710 N-770 Phenolic Novolac
Glass Transition Temperature °C DMA 253 199
°C TMA 227 175
Coefficient of Linear Expansion α1 40 to 60°C (ppm) 54 55
α2 (ppm) 152(*1) 166(*2)
25 to 280°C (ppm) 83 105

[Evaluation Conditions]
Curing agent: Phenolic Novolac (Td-2131: softening point 80°C), Accelerator: TPP (1 phr), Curing conditions: 175°C/5 hr, Filler: None Thickness 2.4 mm

  • *1: 260 to 280°C
  • *2: 230 to 250°C

Cured Material Physical Properties (Tg/Solder-resistant) [Laminate Evaluation]

  • Demonstrates extremely high heat resistance in laminate evaluations
  • The same moisture absorptivity as the phenolic novolac type while having a high functional group density
  • Excellent solder resistance
Product Number HP-4710 N-770 Phenolic Novolac
Glass Transition Temperature °C DMA 266 187
°C TMA 211 159
Moisture Absorptivity (PCT-4 hr) (%) 1.08 1.13
Solder Heat Resistance (PCT-4 hr) OOO OOX

[Evaluation Conditions]
Curing agent: Phenolic Novolac (TD-2090-60M), Accelerator: 2E4MZ, Glass fabric: Nittobo 2116 type (100μm) 6-ply, Curing conditions: 200°C/1.5 hr

Cured Material Physical Properties (Bonding) [Laminate Evaluation]

  • Achieves excellent bonding properties while having high heat resistance
Product Number HP-4710 N-770 Phenolic Novolac
Peel Strength (KN/m) 1.3 1.0
Delamination Strength (KN/m) 0.7 0.6

Solvent Solubility Data

  • Dissolves in general-purpose solvents such as MEK and cyclohexanone
Solvent Type Methyl Ethyl Ketone (MEK) Cyclohexanone Acetone
Nonvolatile Content (wt %) 70 50 30 70 50 30 70 50 30
Heating X X X X X X X X X
Room Temperature X X X X X X X X X
After 1 day X X X X X X X X X
After 3 days X X X X X X X X X
After 5 days X X X X X X X X X
After 7 days X X X X X X X X X
After 14 days - X X X X X X X X
  • * Storage temperature: 25°C, X: Dissolves, -: Crystallization
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