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Bisphenol F

Bisphenol F epoxy resins are used in broad applications including coatings, civil engineering, adhesives, electrical insulating materials, and reactive intermediates. In particular, the liquid resins have low viscosity so they excel in workability and moldability which makes them suited to many applications.

Major Product Specifications & Features

EPICLON Epoxy Equivalent Weight
(g/eq)
Viscosity
(25°C, mPa·s)
Features Applications
830 165 - 177 3000 - 4000 Standard product Civil engineering, adhesives
830-S 165 - 177 3000 - 4500 Low chlorine Civil engineering, adhesives
835 165 - 180 3000 - 4500 Low crystallinity Coatings, adhesives
EXA-830CRP 155 - 163 1100 - 1500 High purity, low viscosity Liquid encapsulant
EXA-830LVP 157 - 165 1200 - 1800 High purity, low viscosity Liquid encapsulant
EXA-835LV 160 - 170 2000 - 2500 High purity Liquid encapsulant

DIC can also customize these products in various ways. Contact us for details.

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